High-density packaging for multiple removable electronics subass

Details High-density packaging for multiple removable electronics subass High-density packaging for multiple removable electronics subass

1993-06-21

1994-07-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

439 46, 439 47, 439 74, 439 75, H01R 2368

Patent

active

053294289

ABSTRACT:
Packaging for an electronics assembly. A base card has a row of elongated slots. A number of individually insertable subassemblies have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.

REFERENCES:
patent: 4969066 (1990-11-01), Eibl et al.
patent: 5113317 (1992-05-01), Holle

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