High density packaging for device requiring large numbers of uni

Details High density packaging for device requiring large numbers of uni High density packaging for device requiring large numbers of uni

1992-01-29

1994-08-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361744, 361748, 361761, 361784, 361796, 174260, 439 64, H01R 2368

Patent

active

053351460

ABSTRACT:
A high density interconnection technique for connecting large numbers of unique signal lines between orthogonally positioned circuit cards, utilizes pins from the back of a zero insertion force connector (ZIF) to extend through the interconnection card and mate with a female socket connector on a second circuit board. Pins from the ZIF connector which are not aligned with the sockets of the orthogonally positioned socket connector may be connected to pins on the interconnection card which are aligned with the socket connector but not the ZIF. Very high numbers of connections between circuit cards may be made in a small volume and maintain signal line length at a minimum to ensure maximum signal transfer speed.

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