High density packages

Details High density packages High density packages

1984-09-19

1985-09-17

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 29827, H05K 506

Patent

active

045422591

ABSTRACT:
Several embodiments of high density packages which form an enclosure adapted to receive electronic devices are disclosed. Each package includes a metal lead frame having staggered leads which extend external to the package. A seal ring construction is provided so that hermetic seals are possible without subjecting the electronic devices to high temperatures. Various metals and sealing materials are advantageously used in the contruction of the devices.

REFERENCES:
patent: 3341369 (1967-09-01), Caule et al.
patent: 3391456 (1968-07-01), Gannoe
patent: 3416348 (1968-12-01), Carter, Jr. et al.
patent: 3475227 (1969-10-01), Caule et al.
patent: 3676292 (1972-07-01), Pryor et al.
patent: 3698964 (1972-10-01), Caule et al.
patent: 3730779 (1973-05-01), Caule et al.
patent: 3810754 (1974-05-01), Ford et al.
patent: 4338621 (1982-07-01), Braun
patent: 4410927 (1983-10-01), Butt
patent: 4434016 (1984-02-01), Saleh et al.
patent: 4463217 (1984-07-01), Orcutt
Honn, Eighty-Pin Package for Field-Effect Transistor Chips, IBM Technical Disclosure Bulletin, vol. 15, No. 1, p. 308, Jun. 1972.

Affiliated with

Also associated with

Rating

High density packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-371053