Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-07-17
2011-11-15
Levi, Dameon (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S264000, C174S266000
Reexamination Certificate
active
08058567
ABSTRACT:
The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).
REFERENCES:
patent: 2004/0136152 (2004-07-01), Mitsuhashi et al.
patent: 2008/0314632 (2008-12-01), Wu et al.
Chuang Ching-Ming
Lan Wei-Wen
Lee Meng-Han
Shang Shi-Shyan James
Levi Dameon
Nan Ya PCB Corp.
Nguyen Hoa C
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