Optical waveguides – With disengagable mechanical connector
Reexamination Certificate
2000-06-19
2001-10-23
Lee, John D. (Department: 2874)
Optical waveguides
With disengagable mechanical connector
C385S088000, C385S134000
Reexamination Certificate
active
06305848
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a high-density blindmate optoelectronic module and mating optical connector. The high-density blindmate optoelectronic module is particularly well suited for use in high capacity optical network assemblies, such as optical routers, Dense Wavelength Division Multiplexed (DWDM) transmission equipment, and optical cross connects.
The above-named optical assemblies, and others like them, require numerous interconnections between various components within the assemblies. Typically, multiple optical transmitters and receivers are required for converting data signals between electrical and optical transmission media. A simplified perspective view of a typical prior art chassis based system is shown in FIG.
1
. The chassis based system
100
includes a rack
102
comprising a plurality of tracks
104
extending perpendicularly from a backplane
106
. The rack
102
is configured to receive a plurality of printed circuit boards
108
. The printed circuit boards
108
may be inserted into tracks
104
and mated with connectors
110
mounted on the backplane
106
. Most such assemblies include racks for receiving large numbers of removable printed circuit boards. The backplane
106
is configured to route signals between various optical and/or electrical circuits formed on the circuit boards
108
inserted into the rack.
The backplane
106
may include embedded optical fibers for carrying optical signals, conductive traces for carrying electrical signals, or some combination of both optical fibers and conductive traces for handling both optical and electrical signals. The optical and/or electrical circuits on the backplane couple signals between various points within the chassis based system, and may perform additional functions such as amplifying, splitting or multiplexing signals. Signals may be routed between printed circuit boards, or to different points on the same circuit board.
The interface between the printed circuit boards
108
and the backplane
106
is formed along the rear edge of the printed circuit boards as the boards are inserted into the rack. The interface is formed by the act of inserting the printed circuit board into the rack. This is known in the art as a blindmate connection because the connector components that form the interface align and mate of their own accord when the printed circuit board is installed in the rack and the interface occurs within the rack, away from the technician installing the printed circuit board. In such a connector, the signal interface must automatically couple each signal that is to be transmitted from the printed circuit board to the appropriate backplane circuit, be it an optical fiber or a conductive circuit trace. Similarly, each signal originating from the backplane and destined for a circuit formed on the circuit board must also be properly coupled with the correct circuit elements on the printed circuit board. All of this must be achieved by the simple act of inserting the printed circuit board into the rack.
The necessity of providing a blindmate connection between the removable circuit boards and the backplane poses significant difficulties for creating an optical interface capable of handling a large number of optical signals. The current generation of optoelectronic assemblies use fiber-optic connectors mounted on both the backplane and along the rear edge of the removable printed circuit boards. Fiber-optic connectors employed for this purpose may use single fiber connector ferrules or multi-fiber connector ferrules. Typically, optoelectronic modules will be mounted on the surface of a printed circuit board and optical fiber jumpers will be installed between the transceivers and the optical connectors mounted on the edge of the circuit board. The jumpers carry the optical signals emitted from the optical transmitters to the optical connector or from the connector to the optical receivers mounted elsewhere on the printed circuit board. A problem with this arrangement is that the optical transmitters and receivers (commonly referred to together as transceivers) take up a great deal of real estate on the printed circuit board, occupying space which could otherwise be dedicated to other purposes and provide additional functionality to the printed circuit board. Also, installing the optical fiber jumpers between the transceiver elements and the connector interface is time-consuming and expensive. The additional jumper attenuates the optical signal and adds to the cost.
Therefore, a need exists for a high-density blindmate optoelectronic module. Preferably, such a high-density blindmate optoelectronic module will include optical transmitters and receivers mounted directly within the module. The transceiver components will be arranged so that optical signals both transmitted and received by the module may be coupled directly to the backplane of a chassis based system, and the interface between the module and the backplane connector will form a blindmate optical connection whereby the high-density blindmate optoelectronic module is coupled to the backplane by sliding the printed circuit board on which the module is mounted into the chassis based system's support rack. It is desirable that such a high-density blindmate optoelectronic module occupy as little space as possible on the printed circuit board. It is also desirable that signals be directly coupled between the module's optical interface and the backplane without the need for optical fiber jumpers. Finally, it is also desirable that a high-density optoelectronic interface module have improved heat dissipation characteristics to protect the transceiver components within the module.
SUMMARY OF THE INVENTION
The present invention provides a high-density blindmate optoelectronic module. The module is adapted to be mounted along the rearward edge of a printed circuit board which is configured to be inserted into a rack support system within a chassis based system such as a network of routers, DWDM transmission equipment, optical cross connects, or other optoelectronic assemblies.
Throughout this specification the removable printed circuit boards that are configured to be inserted into the chassis based system's support rack and which interface with the backplane of the chassis based system will be referred to as a “mother boards”. Each mother board may have additional components mounted on separate “daughter” cards that are interconnected with the circuits formed on the mother boards.
The high-density blindmate optoelectronic module is configured to quickly and accurately mate with the various circuits of a mother board. Further, the high-density blindmate optoelectronic module is adapted to blindmate with an optical connector mounted on the backplane of the chassis based system as the mother board is inserted into the support rack. Alignment structures within the high-density blindmate optoelectronic module act to align the optical signals emitted from the optical transmitting elements to optical fibers supported within the mating optical connector mounted on the backplane. Likewise, the optical signals carried by optical fibers within the backplane and terminating within the backplane mounted optical connector are aligned with optical receiver components within the high-density blindmate optoelectronic module.
In an embodiment of the invention, a high-density blindmate optoelectronic module comprises a transceiver mounting block. A plurality of daughter cards are mounted side by side within the transceiver mounting block. One or more optical transmitters, optical receivers, or combination of transmitters and receivers are mounted within the connectorized optical sub-assembly contained on each daughter card. Because density is critical, daughter cards are mounted perpendicular to the motherboard in a configuration that allows substantial increases in optical channel density. A pair of fine alignment pins protrude from a front surface of each connectorized optical sub-assembly and a pair of coarse ali
Corona Optical Systems, Inc.
Lee John D.
Welsh & Katz Ltd.
LandOfFree
High density optoelectronic transceiver module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density optoelectronic transceiver module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density optoelectronic transceiver module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2559655