High density nanostructured interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Reexamination Certificate

active

07402913

ABSTRACT:
A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

REFERENCES:
patent: 6185961 (2001-02-01), Tonucci et al.
patent: 6297063 (2001-10-01), Brown et al.
patent: 6340822 (2002-01-01), Brown et al.
patent: 6383923 (2002-05-01), Brown et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6828685 (2004-12-01), Stasiak
patent: 2002/0014667 (2002-02-01), Shin et al.
patent: 2003/0175154 (2003-09-01), Hsu et al.
patent: 2005/0066883 (2005-03-01), Dubrow et al.
patent: 2005/0224975 (2005-10-01), Basavanhally et al.
patent: 1100297 (2001-05-01), None
patent: 11320111 (2003-06-01), None
patent: 02/099845 (2002-12-01), None
European Search Report, Application No. 05251771.1—2203 PCT/ dated Sep. 14, 2005.
Geim, A.K. et al.; “Microfabricated Adhesive Mimicking Gecko Foot-Hair”; Nature Materials, vol. 2; Jul. 2003/www.nature.com
aturematerials; pp. 461-463.
van der Walls; “Intermolecular Bonding—Van Der Walls Forces”; published on the internet at http:.//www.chemguide.co.uk/atoms/bonding/vdw.html; Mar. 2004; pp. 7.

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