High density multilayer wiring board and the manufacturing there

Details High density multilayer wiring board and the manufacturing there High density multilayer wiring board and the manufacturing there

1988-05-20

1989-06-06

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

252514, 264 61, 361414, H05K 109

Patent

active

048374083

ABSTRACT:
A multilayered wiring board comprising a plurality of green sheets of crystallizable glass which have a conductive pattern printed thereon. The green sheets are laminated together and sintered as a unit. The conductive composition used for the conductive pattern mainly comprises Cu or CuO with lesser amounts of MnO.sub.2. According to two embodiments the conductive composition additionally contains (1) Pd and/or Pt or (2) Ag.sub.2 O and TiO.sub.2 or TiH.sub.2. Thereby volume contraction due CuO reduction cancels out volume expansion due to Cu oxidation in the subsequent degreasing.

REFERENCES:
patent: 3293501 (1966-12-01), Martin
patent: 3776769 (1973-12-01), Buck et al.
patent: 3843350 (1974-10-01), Larry
patent: 3851228 (1974-11-01), Sheard
patent: 4072771 (1978-02-01), Grier
patent: 4109377 (1978-08-01), Blazik
patent: 4446059 (1984-05-01), Eustice
patent: 4705917 (1987-11-01), Gates et al.
patent: 4756848 (1988-07-01), Tieke et al.

Affiliated with

Also associated with

Rating

High density multilayer wiring board and the manufacturing there does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density multilayer wiring board and the manufacturing there, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density multilayer wiring board and the manufacturing there will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-41894