High density multilayer printed circuit card assembly and method

Details High density multilayer printed circuit card assembly and method High density multilayer printed circuit card assembly and method

1973-10-17

1977-04-05

Smith, Jr., David

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361397, H02B 100

Patent

active

040164632

ABSTRACT:
A high density multilayer printed circuit card assembly having plated through holes in electrical contact with the layers of conducting metal. The card is provided with bonding pads in contact with the plated through holes whereby wiring may be selectively utilized to form interconnections for components carried by the card. Signal lines are brought to the surface so that they can be interrupted and changes be made by wiring. Components of various types are arranged in rows to facilitate cooling.

REFERENCES:
patent: 3300686 (1967-01-01), Johnson et al.
patent: 3564114 (1971-02-01), Blinder
patent: 3629730 (1971-12-01), Penzel et al.
patent: 3680005 (1972-07-01), Jorgensen et al.
patent: 3726002 (1973-04-01), Greenstein et al.

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