High density multilayer printed circuit board

Details High density multilayer printed circuit board High density multilayer printed circuit board

1985-12-20

1987-06-23

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, H05K 114

Patent

active

046757899

ABSTRACT:
A high density multilayer printed circuit board comprising generally parallel signal layers, electric source layers, and ground layers, with insulating layers arranged between the signal layers and the electric source layers, between the electric source layers and the ground layers, and between the ground layers and the signal layers respectively. Conductor portions are formed in through holes which are opened in a direction transverse to the signal layers, electric source layers, and ground layers. The conductor portions are electrically connected to the signal layers and/or the electric source layers, and/or the ground layers, through the lands thereof, the connections of the lands being substantially equally distributed among the conductor portions.

REFERENCES:
patent: 3519959 (1970-08-01), Bewley et al.
patent: 3568000 (1971-03-01), D'Aboville
patent: 3680005 (1972-07-01), Jorgeson et al.
patent: 3740678 (1973-06-01), Hill
patent: 4362899 (1982-12-01), Borrill
patent: 4498122 (1985-02-01), Rainal
Jarvell et al., Wirability Enhancement, IBM Tech. Disc. Bull., vol. 21, #9 Feb. 1979 p. 3624 relied on.

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