Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-11-24
1999-10-19
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 83, H01R 909
Patent
active
059677970
ABSTRACT:
A land grid array (LGA) includes a base having a first surface and a second surface which is substantially parallel thereto. The base is formed with a plurality of apertures which open through the base, and a plurality of electrical connectors are mounted on the base. Specifically, the connectors are formed with a central portion, and each connector has one deflectable finger and one extension which project in opposite directions from this central portion. The central portion of the connector is embedded into the base to cantilever the finger and the extension into respective juxtaposed apertures. When not deflected, the finger of the connector projects outwardly from its aperture and beyond the first surface of the base, while the extension is formed with a solder point surface which is generally coplanar with the second surface of the base. In a plurality of apertures, one finger projects one way and another finger projects the other way. With this combination, the electrical contact tips of the fingers are arranged as two matrices, one over the first surface of the base and the other over the second surface. Thus, a plurality of circuits are established between the first surface of the array and the second surface.
REFERENCES:
patent: 4021091 (1977-05-01), Anhalt et al.
patent: 4159154 (1979-06-01), Arnold
patent: 4538864 (1985-09-01), Ichimura
patent: 4867689 (1989-09-01), Redmond et al.
patent: 4936784 (1990-06-01), Saito
patent: 4976629 (1990-12-01), Werner
patent: 5139427 (1992-08-01), Boyd et al.
patent: 5147207 (1992-09-01), Mowry
patent: 5161982 (1992-11-01), Mowry
patent: 5226826 (1993-07-01), Nillson et al.
patent: 5380210 (1995-01-01), Grabbe et al.
patent: 5395252 (1995-03-01), White
patent: 5462440 (1995-10-01), Rothenberger
Abrams Neil
Patel T C
Teledyne Industries Inc.
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