Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1990-12-21
1992-04-21
Hearn, Brian E.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
437195, 437180, C25D 500
Patent
active
051064618
ABSTRACT:
A multi-layer interconnect structure of alternating dielectric (e.g., polyimide) and metal (e.g., copper) is built on a substrate supporting a continuous layer of metal. This metal layer is used as an electrode for plating vias through all the dielectric layers. Once the desired number of layers are formed, the substrate is removed and the continuous metal layer is patterned. Solid metal vias having nearly vertical side walls can be stacked vertically, producing good electrical and thermal transfer paths and permitting small, closely-spaced conductors. Further, by mixing geometrical shapes of conductors, a variety of useful structures can be achieved, such as controlled impedance transmission lines and multiconductor TAB tape with interconnects on tape of different dimensions than TAB fingers.
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Product Descriptions, Data Sheets and Bulletins.
Overheads from a presentation by David J. Arthur.
Senturia Stephen D.
Volfson David
Dang Trung
Hearn Brian E.
Massachusetts Institute of Technology
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