High density multi-lead surface mount interconnect and...

Details High density multi-lead surface mount interconnect and... High density multi-lead surface mount interconnect and...

2006-06-13

2006-06-13

Ta, Tho D. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S074000

Reexamination Certificate

active

07059867

ABSTRACT:
A multi-lead surface mount interconnect. The interconnect includes a carrier, a first lead connected to the carrier, and a second lead connected to the carrier. The carrier defines a first receiving area and a second receiving area. The first lead includes a first planar surface for connection to a first printed circuit board and a second planar surface for connection to a second printed circuit board. The first planar surface is opposite the second planar surface. The second lead includes a third planar surface for connection to the first printed circuit board and a fourth planar surface for connection to the second printed circuit board. The third planar surface is opposite the fourth planar surface. The first planar surface is coplanar with the third planar surface. The second planar surface is coplanar with the fourth planar surface.

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