High density multi-layered integrated circuit package

Details High density multi-layered integrated circuit package High density multi-layered integrated circuit package

1985-05-08

1987-04-21

Fields, Carolyn E.

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

250332, 250370, 174 685, 361414, H01L 2714, H05K 114

Patent

active

046599312

ABSTRACT:
A method and apparatus are disclosed for forming a high density multi-layered detector array module. The module body is formed of multiple non-conductive, thin film layers supporting a plurality of electronic devices. The module utilizes conductive patterns formed on the surface of a plurality of the layers to effect connections between and among electronic devices and external electronics. A detector array and an electrical interconnect may be joined to end portions of the module, in electrical communication with the layer conductive patterns. Transverse conductive connectors such as vias are provided within the module extending between the layers. Connections between and among the electronic devices and external electronics are thereby supported by transverse connections within the module and the electrical interconnect. The interconnect may be formed as a back plane extending transverse to the plane of the layers or as a plurality of discrete conductive strips disposed on the surface of one or more of the layers.

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