High density multi-layer microcoil and method for...

Details High density multi-layer microcoil and method for... High density multi-layer microcoil and method for...

2005-04-05

2005-04-05

Nguyen, Tuyen T (Department: 2832)

Inductor devices

Core forms casing

C336S200000

Reexamination Certificate

active

06876285

ABSTRACT:
A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.

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patent: 5852866 (1998-12-01), Kuettner et al.
patent: 5877924 (1999-03-01), Saito
patent: 6015742 (2000-01-01), Ju
patent: 6441715 (2002-08-01), Johnson

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