High density multi-chip interconnection and cooling package

Details High density multi-chip interconnection and cooling package High density multi-chip interconnection and cooling package

1985-08-08

1988-05-31

Pellinen, A. D.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, 361382, 361393, H02D 100

Patent

active

047484950

ABSTRACT:
A package for mounting and cooling a high density array of integrated circuit chips includes an interconnection assembly for the IC chips which (1) provides base connections to a printed circuit board (PCB), which is adapted to connect to external signal circuits, and (2) separate peripheral power supply connections. The package also includes a cooling module containing fluid-cooled heat sinks that (a) collectively conform to the array of integrated circuit chips and (b) individually conform to the configuration and orientation of the individual chips. The heat sinks are conformed to the chip orientation independently of the coolant flow, which is established through the heat sinks immediately adjacent the interface. Among other aspects of the package, the interconnection assembly incorporates resilient connectors that provide essentially stress-impervious connections to the integrated circuit chips and to the signal PCB.

REFERENCES:
patent: 3864607 (1975-02-01), Phillips
patent: 4153107 (1979-05-01), Antonetti et al.
patent: 4203129 (1980-05-01), Oktay et al.
patent: 4458291 (1984-07-01), Yanagisawa et al.
patent: 4546376 (1985-10-01), Olsen et al.
patent: 4603345 (1986-07-01), Lee et al.
patent: 4620215 (1986-10-01), Lee
Mounting Technique for Solder Reflow Areal Array Mounted Silicon Chips which Allows Direct and Efficient Backside Heat Removal, IBM Tech. Disclosure, vol. 20, No. 12, May 1978.
New TCM Design Using Bellows, IBM Tech. Disclosure, vol. 28, No. 11, Apr. 1986.
Wilson, "Cooling Modern Main Frames-A Liquid Approach", Computer Design, 1983, pp. 219-225.
Markstein, "Surface-Mount Substrates: The Key in Going Leadless", Electronic Packaging and Production, 1983, pp. 50-55.
Blodgett et al., "Thermal Conduction Module: A High Performance Multi-Layer Ceramic Package", IBM J. Res. Develop. 26 1, 1982, pp. 30-35.

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