High-density mounting method and structure for electronic circui

Details High-density mounting method and structure for electronic circui High-density mounting method and structure for electronic circui

1997-05-30

1999-02-23

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257723, 257773, 361761, 361773, 361792, H05K 114, H05K 116

Patent

active

058751009

ABSTRACT:
In a high-density mounting method for an electronic circuit board, a stud bump is formed on a connection terminal of a semiconductor chip. The semiconductor chip is buried in a printed circuit board such that the stud bump has a height almost equal to that of a surface of the printed circuit board. At least a surface of the printed circuit board where the semiconductor chip is buried is covered with a first insulating layer. A hole is formed in the first insulating layer by using a laser to expose the stud bump. A first wiring pattern is selectively formed on the first insulating layer, thereby connecting the first wiring pattern and the exposed stud bump to each other. A high-density mounting structure for an electronic circuit board is also disclosed.

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