High density mother/daughter circuit board connector

Details High density mother/daughter circuit board connector High density mother/daughter circuit board connector

1984-04-09

1986-05-06

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361413, 361415, 339 17M, 339176MP, 339176MF, H05K 118

Patent

active

045875960

ABSTRACT:
A high density mother/daughter circuit board connector utilizes a multi-layer flat flexible circuit, each layer of which contains a plurality of patterned arrays of circuit paths extending between spaced contact points, at least some of which are exposed through apertures in overlying layers. The multi-layered circuitry is wrapped around a housing from a mother circuit board face to extend into one side of a daughter board receiving recess. Camming means arranged in the opposite side of the recess drive a daughter circuit board inserted therein transversely of the recess into loaded engagement with the multi-layer circuitry thereby establishing electrical interconnection between the circuitry of the mother and daughter circuit boards.

REFERENCES:
patent: 3401369 (1968-09-01), Palmateer et al.
patent: 3489990 (1970-01-01), Parker et al.
patent: 3609463 (1971-09-01), Laboue
patent: 3772775 (1973-11-01), Bonnke et al.
patent: 3922054 (1975-11-01), Dechelette
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 4116516 (1978-09-01), Griffin
patent: 4211459 (1980-07-01), Madden
Hinrichsmeyer et al, Combined Action Zero Insertion Force Connector, IBM Tech. Disc. Bull., vol. 26, #12, May 1984, pp. 6476 and 6477.

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