High density memory module using stacked printed circuit boards

Details High density memory module using stacked printed circuit boards High density memory module using stacked printed circuit boards

2008-05-20

2008-05-20

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S715000, C361S719000, C257S706000, C257S712000, C165S080200

Reexamination Certificate

active

07375970

ABSTRACT:
A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and the electrical contacts.

REFERENCES:
patent: 2006/0268524 (2006-11-01), Uehara et al.
patent: 2007/0070607 (2007-03-01), Goodwin
patent: 2007/0139897 (2007-06-01), RaghuRam
patent: 2007/0201208 (2007-08-01), Goodwin et al.
patent: 2008/0013282 (2008-01-01), Hoss et al.

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