Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-05-02
1994-12-20
Rosenbaum, Mark
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 66, 439 91, 174264, H01R 909
Patent
active
053741960
ABSTRACT:
A high-density laminated connector comprises a plurality of layers of rigid dielectric material which are laminated together. The rigid construction of the connector permits precise dimensions of the connecter and, thus, accurate attachment of adjacent circuit boards. The dielectric contains traces which are joined to contact pads, connecting the traces to adjacent circuit boards. The contact pads are comprised of soft gold, solder, and various elastomeric materials. The use of soft gold contacts allows the connector to be easily removed from the adjacent circuit board. Alternatively, the rigid dielectric layers contain recesses where the contact pads are placed. This ensures physical alignment of the circuit board and the connector, so that dimensional integrity is maintained when pressure is applied to the connector. The traces within the connector can be of a varied width, pitch, and direction. Thus, right-angle interconnections can be made. Cross-traces can be placed on each individual layer of dielectric or vias made through the dielectric layers, to interconnect traces. The trace width can be economically and accurately narrowed to produce high aspect ratios and thus provide high signal density.
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Bryant David P.
Fujitsu Limited
Rosenbaum Mark
LandOfFree
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