High density interconnection means for chip carriers

Details High density interconnection means for chip carriers High density interconnection means for chip carriers

1981-02-27

1983-03-22

Rosenbaum, Mark

Geometrical instruments

H05K 118

Patent

active

043773168

ABSTRACT:
A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.

REFERENCES:
patent: 3558993 (1971-01-01), Rigby
patent: 3880493 (1975-04-01), Lockhart, Jr.
patent: 3900239 (1975-08-01), Anhalt et al.
patent: 3942854 (1976-03-01), Klein et al.
patent: 3952231 (1976-04-01), Davidson et al.

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