High density interconnection device

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part

Reexamination Certificate

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Reexamination Certificate

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06923683

ABSTRACT:
A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.

REFERENCES:
patent: 5329427 (1994-07-01), Hogdahl
patent: 5585837 (1996-12-01), Nixon
patent: 5793352 (1998-08-01), Greenberg
patent: 5867223 (1999-02-01), Schindler et al.
patent: 6169879 (2001-01-01), Perlman
Photograph: Top perspective view of a device from 3dfx Interactive, Inc. (1999).
Photograph: Side perspective view of a device from 3dfx Interactive, Inc. (1999).
Photograph: Front perspective view of a device from 3dfx Interactive, Inc. (1999).
Photograph: Top plan view of a device from 3dfx Interactive, Inc. (1999).

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