Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-06-30
1994-05-31
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361788, 395800, H05K 710, G06F 116
Patent
active
053174771
ABSTRACT:
A high density computer interconnection assembly is provided by a plurality of flat packages slidably mounted along a rack in a frame in one given plane. The packages include edge connected processors and switch modules with associated power supply. One or two interconnection wiring circuit boards extend perpendicular to the one given plane and adjacent and along the edge of the edge connected modules to couple thereto whereby the interconnection circuit board couples said switch modules to said processor modules along one broad surface of said interconnection circuit board. Memory cards are coupled to the opposite broad surface of the interconnection circuit board.
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Donner et al., "Board-To-Board Interconnects in a Thermal Conduction Module System", IBM Technical Disclosure Bulletin, vol. 32, No. 3B, Aug. 1989, pp. 464-467.
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Baust et al., "Implementing a Packaging Strategy for High-Performance Computers". High Performance Systems, no date given.
Gillett, "High Performance Computer System Package", Application Ser. No. 07/675,583.
Gonzalez Floyd A.
International Business Machines - Corporation
Phillips Michael W.
Picard Leo P.
Troike Robert L.
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