High density interconnect with electroplated conductors

Details High density interconnect with electroplated conductors High density interconnect with electroplated conductors

1992-06-08

1993-07-27

Niebling, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Having variation in thickness

174261, 205123, 205125, 428469, 428472, 4284722, 428610, 428629, 428935, C25D 502

Patent

active

052309657

ABSTRACT:
Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.

REFERENCES:
patent: 3098804 (1963-07-01), Wittrock
patent: 3505181 (1970-04-01), Marshall
patent: 3708403 (1973-01-01), Koger et al.
patent: 3915811 (1975-10-01), Jremmel et al.
patent: 4092448 (1978-05-01), Coll-Palagos
patent: 4236940 (1980-12-01), Manty et al.
patent: 4443454 (1984-03-01), Dohya et al.
patent: 4753851 (1988-06-01), Roberts et al.
patent: 4786523 (1988-11-01), Dohya
patent: 4917963 (1990-04-01), Kittler
patent: 4988412 (1991-01-01), Liu et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 452-459.

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