High-density interconnect technique

Details High-density interconnect technique High-density interconnect technique

1993-12-01

1995-07-04

Bilinsky, Z. R.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

439 79, H01R 909

Patent

active

054295106

ABSTRACT:
A high density interconnect system (30) employs contact fingers (32) on both surfaces (34) and (36) of burn-in PCB (38), feed-through PCB (40) and driver PCB (42). Each of the PCBs (38), (40) and (42) has a card-edge connector (44), (46) and (48). The feed-through PCB (40) has a second card-edge connector (40) and a second set of contact fingers (32), since it mates with both the burn-in PCB (38) and the driver PCB (42). The contact fingers (32) and the card-edge connectors (44), (46), (48) and (50) of each PCB (38), (40) and (42) mate inversely with each other on adjacent PCBs, i.e., the card-edge connector (44) of the burn-in PCB (38) mates with the contact fingers (32) of the feed-through PCB (40), and the card-edge connector (46) of the feed-through PCB (40) mates with the contact fingers (32) of the burn-in PCB (38), for example. The same relationship exists between the card-edge connector (50) of the feed-through PCB (40), the card-edge connector (48) of the driver PCB (42) and the contact fingers (32) of the feed-through PCB(40) and the driver PCB (42).

REFERENCES:
patent: 3771100 (1973-11-01), Reed
patent: 4623207 (1986-11-01), Sasaki et al.
patent: 4738625 (1988-04-01), Burton et al.
patent: 5305182 (1994-04-01), Chen

Affiliated with

Also associated with

Rating

High-density interconnect technique does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-density interconnect technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-density interconnect technique will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-756409