High density interconnect system having rapid fabrication cycle

Details High density interconnect system having rapid fabrication cycle High density interconnect system having rapid fabrication cycle

2011-01-18

2011-01-18

Nguyen, Ha Tran T (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07872482

ABSTRACT:
An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

REFERENCES:
patent: 3806800 (1974-04-01), Bove et al.
patent: 3806801 (1974-04-01), Bove
patent: 3810017 (1974-05-01), Wiesler et al.
patent: 3835381 (1974-09-01), Garretson et al.
patent: 3842189 (1974-10-01), Southgate
patent: 3856647 (1974-12-01), Blachman
patent: 3939414 (1976-02-01), Roch
patent: 4000045 (1976-12-01), Rotzow
patent: 4035046 (1977-07-01), Kloth
patent: 4038599 (1977-07-01), Bove et al.
patent: 4177425 (1979-12-01), Lenz
patent: 4195259 (1980-03-01), Reid et al.
patent: 4201393 (1980-05-01), Kawashima et al.
patent: 4214201 (1980-07-01), Kern
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4362991 (1982-12-01), Carbine
patent: 4416759 (1983-11-01), Harra
patent: 4423376 (1983-12-01), Byrnes et al.
patent: 4423401 (1983-12-01), Mueller
patent: 4436602 (1984-03-01), Harra
patent: 4480223 (1984-10-01), Aigo
patent: 4508612 (1985-04-01), Blackwell et al.
patent: 4518910 (1985-05-01), Hottenrott et al.
patent: 4522893 (1985-06-01), Bohlen et al.
patent: 4548451 (1985-10-01), Benarr et al.
patent: 4567432 (1986-01-01), Buol et al.
patent: 4599559 (1986-07-01), Evans
patent: 4622514 (1986-11-01), Lewis
patent: 4636722 (1987-01-01), Ardezzone
patent: 4647852 (1987-03-01), Smith et al.
patent: 4661233 (1987-04-01), Glasser
patent: 4667154 (1987-05-01), Allerton et al.
patent: 4686464 (1987-08-01), Elsasser et al.
patent: 4716500 (1987-12-01), Payne
patent: 4719417 (1988-01-01), Evans
patent: 4724377 (1988-02-01), Maelzer et al.
patent: 4758927 (1988-07-01), Berg
patent: 4764723 (1988-08-01), Strid
patent: 4816754 (1989-03-01), Buechele et al.
patent: 4834855 (1989-05-01), Bloomquist et al.
patent: 4837622 (1989-06-01), Whann et al.
patent: 4908571 (1990-03-01), Stoehr
patent: 4924589 (1990-05-01), Leedy
patent: 4933045 (1990-06-01), DiStefano et al.
patent: 4942076 (1990-07-01), Panicker et al.
patent: 4956923 (1990-09-01), Pettingell et al.
patent: 4965865 (1990-10-01), Trenary
patent: 4970106 (1990-11-01), DiStefano et al.
patent: 4973903 (1990-11-01), Schemmel
patent: 4975638 (1990-12-01), Evans et al.
patent: 5032896 (1991-07-01), Little et al.
patent: 5055778 (1991-10-01), Okubo et al.
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5084672 (1992-01-01), Ikeuchi et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5109596 (1992-05-01), Driller et al.
patent: 5121298 (1992-06-01), Sarma et al.
patent: 5144228 (1992-09-01), Sorna et al.
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5154810 (1992-10-01), Kamerling et al.
patent: 5166774 (1992-11-01), Banerji et al.
patent: 5189363 (1993-02-01), Bregman et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5208531 (1993-05-01), Aton
patent: 5210485 (1993-05-01), Kreiger et al.
patent: 5214375 (1993-05-01), Ikeuchi et al.
patent: 5225037 (1993-07-01), Elder et al.
patent: 5227718 (1993-07-01), Stowers et al.
patent: 5240583 (1993-08-01), Ahonen
patent: 5255079 (1993-10-01), Kageyama
patent: 5258648 (1993-11-01), Lin
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5280139 (1994-01-01), Suppelsa et al.
patent: 5313157 (1994-05-01), Pasiecznik, Jr.
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5352266 (1994-10-01), Erb et al.
patent: 5354205 (1994-10-01), Feigenbaum
patent: 5367764 (1994-11-01), DiStefano et al.
patent: 5373627 (1994-12-01), Grebe
patent: 5385477 (1995-01-01), Vaynkof et al.
patent: 5395253 (1995-03-01), Crumly
patent: 5412866 (1995-05-01), Woith et al.
patent: 5416429 (1995-05-01), McQuade et al.
patent: 5433797 (1995-07-01), Erb et al.
patent: 5440241 (1995-08-01), King et al.
patent: 5473254 (1995-12-01), Asar
patent: 5476211 (1995-12-01), Khandros
patent: 5489852 (1996-02-01), Gomez
patent: 5521518 (1996-05-01), Higgins
patent: 5521523 (1996-05-01), Kimura et al.
patent: 5523697 (1996-06-01), Farnworth et al.
patent: 5530371 (1996-06-01), Perry et al.
patent: 5532612 (1996-07-01), Liang
patent: 5532613 (1996-07-01), Nagasawa et al.
patent: 5534784 (1996-07-01), Lum et al.
patent: 5546012 (1996-08-01), Perry et al.
patent: 5555422 (1996-09-01), Nakano
patent: 5558928 (1996-09-01), DiStefano et al.
patent: 5563521 (1996-10-01), Crumbly
patent: 5568054 (1996-10-01), Iino et al.
patent: 5570032 (1996-10-01), Atkins et al.
patent: 5600257 (1997-02-01), Leas et al.
patent: 5613861 (1997-03-01), Smith et al.
patent: 5621333 (1997-04-01), Long et al.
patent: 5621373 (1997-04-01), McCormick
patent: 5629631 (1997-05-01), Perry et al.
patent: 5631571 (1997-05-01), Spaziani et al.
patent: 5635846 (1997-06-01), Beaman et al.
patent: 5656138 (1997-08-01), Scobey et al.
patent: 5657394 (1997-08-01), Schwartz et al.
patent: 5663596 (1997-09-01), Little
patent: 5665648 (1997-09-01), Little
patent: 5670889 (1997-09-01), Okubo et al.
patent: 5694050 (1997-12-01), Noguchi
patent: 5703494 (1997-12-01), Sano
patent: 5707575 (1998-01-01), Litt et al.
patent: 5744283 (1998-04-01), Spierings et al.
patent: 5756021 (1998-05-01), Hedrick et al.
patent: 5763941 (1998-06-01), Flejstad
patent: 5764070 (1998-06-01), Pedder
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5786701 (1998-07-01), Pedder
patent: 5798027 (1998-08-01), Lefebvre et al.
patent: 5800184 (1998-09-01), Lopergolo et al.
patent: 5801441 (1998-09-01), Smith et al.
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5820014 (1998-10-01), Dozier, II et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5821764 (1998-10-01), Slocum et al.
patent: 5828226 (1998-10-01), Higgins et al.
patent: D401250 (1998-11-01), Tudhope
patent: D401251 (1998-11-01), Tudhope
patent: D401252 (1998-11-01), Tudhope
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5830327 (1998-11-01), Kolenkow
patent: 5832598 (1998-11-01), Greenman et al.
patent: 5832601 (1998-11-01), Eldridge et al.
patent: D403002 (1998-12-01), Tudhope
patent: D403334 (1998-12-01), Tudhope
patent: 5844421 (1998-12-01), Lee et al.
patent: 5847572 (1998-12-01), Iwasaki et al.
patent: 5848685 (1998-12-01), Smith et al.
patent: 5852871 (1998-12-01), Khandros
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5869974 (1999-02-01), Akram et al.
patent: 5878486 (1999-03-01), Eldridge et al.
patent: 5884395 (1999-03-01), Dabrowiecki et al.
patent: 5884398 (1999-03-01), Eldridge et al.
patent: 5886535 (1999-03-01), Budnaitis et al.
patent: 5896038 (1999-04-01), Budnaitis et al.
patent: 5897326 (1999-04-01), Eldridge et al.
patent: 5900738 (1999-05-01), Khandros et al.
patent: 5905305 (1999-05-01), Fogal et al.
patent: 5912046 (1999-06-01), Eldridge et al.
patent: 5914218 (1999-06-01), Smith et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5926951 (1999-07-01), Khandros et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5955888 (1999-09-01), Frederickson et al.
patent: 5968327 (1999-10-01), Kobayashi
patent: 5973504 (1999-10-01), Chong et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 5977787 (1999-11-01), Das et al.
patent: 5979892 (1999-11-01), Smith
patent: 5983493 (1999-11-01), Eldridge et al.
patent: 5993616 (1999

Affiliated with

Also associated with

Rating

High density interconnect system having rapid fabrication cycle does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density interconnect system having rapid fabrication cycle, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density interconnect system having rapid fabrication cycle will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2737261