High density interconnect system for IC packages and...

Details High density interconnect system for IC packages and... High density interconnect system for IC packages and...

2009-08-24

2010-10-12

Nguyen, Ha T. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07812626

ABSTRACT:
An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket assemblies, and/or probe card assembly systems. An exemplary connector comprises a first connector structure comprising a contactor substrate having a contact surface and a bonding surface, and one or more electrically conductive micro-fabricated spring contacts extending from the probe surface, a second connector structure comprising at least one substrate and having a set of at least one electrically conductive contact pad located on a connector surface and corresponding to the set of spring contacts, and means for movably positioning and aligning the first connector structure and the second connector structure between at least a first position and a second position, such that in at least one position, at least one electrically conductive micro-fabricated spring contact is electrically connected to at least one electrically conductive contact pad.

REFERENCES:
patent: 6477682 (2002-11-01), Cypher
patent: 6744262 (2004-06-01), Adamian

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