High density interconnect system

Details High density interconnect system High density interconnect system

1988-05-23

1989-06-13

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

361405, H01R 909

Patent

active

048388009

ABSTRACT:
Plated-through-holes of printed circuit boards are segmented to provide a plurality of conductors. Matching connector pins having insulating cores and patterned conductive portions are mated with the conductors of the plated-through-holes. Each of the conductors of the holes can be connected to a different one of the patterns on the printed circuit boards thus forming a high density interconnect system.

REFERENCES:
patent: 3184532 (1965-05-01), Spera
patent: 3429041 (1969-02-01), Patton
patent: 4654472 (1987-03-01), Goldfarb
IBM Bulletin, Joshi et al, vol. 20, No. 9, p. 3403, 2-1978.

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