Telecommunications – Transmitter – With casing or housing
Reexamination Certificate
2006-05-30
2006-05-30
To, Doris H. (Department: 2682)
Telecommunications
Transmitter
With casing or housing
C455S550100, C455S552100, C455S553100, C361S748000
Reexamination Certificate
active
07054599
ABSTRACT:
A radio and method of making the radio is disclosed having a first set of radio components for processing analog signals in a radio transmission and a second set of radio components for processing digital signals in a radio transmission. The radio comprises a substrate base support, and at least one pocket formed within the substrate. The radio comprises at least one processor, each of the at least one processor being within a corresponding one of the at least one pocket for modulating a radio signal into one of a plurality of waveforms based on a software instruction set. Each of the at least one processor being in electronic communication with both of the first and second sets of the radio components. A dielectric layer covers a top surface of the substrate and each of the at least one processor. A plurality of vias are formed in the dielectric layer to expose selected portions of each of the at least one processor. A metallization layer is formed over the dielectric layer and over the plurality of vias so that each of the at least one processor is in electrical communication with the first and second sets of radio components.
REFERENCES:
patent: 4437718 (1984-03-01), Selinko
patent: 4730232 (1988-03-01), Lindberg
patent: 4910643 (1990-03-01), Williams
patent: 5033977 (1991-07-01), Ignasiak
patent: 6388205 (2002-05-01), Chua
patent: 6421225 (2002-07-01), Bergstedt
patent: 2002/0195610 (2002-12-01), Klosowiak
patent: 2003/0015720 (2003-01-01), Lian et al.
patent: 2003/0156402 (2003-08-01), Ding et al.
patent: 2004/0042190 (2004-03-01), Eng et al.
Frey Richard Louis
Ma Kelvin
Mahony Michael Joseph
Soderberg John Jesse
Dao Minh
Lockheed Martin Corporation
Scully , Scott, Murphy & Presser, P.C.
To Doris H.
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