High density interconnect apparatus

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge

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Details

439 67, 439161, 439260, 361413, H01R 2370, H05K 111

Patent

active

051675110

ABSTRACT:
The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.

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