High density interconnect

Details High density interconnect High density interconnect

2006-08-22

2006-08-22

Nguyen, Khiem (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S067000

Reexamination Certificate

active

07094063

ABSTRACT:
An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.

REFERENCES:
patent: 5759047 (1998-06-01), Brodsky et al.
patent: 6005777 (1999-12-01), Bloom et al.
patent: 6024579 (2000-02-01), Bennett
patent: 6196852 (2001-03-01), Neumann et al.
patent: 6200141 (2001-03-01), Sinclair
patent: 6205660 (2001-03-01), Fjelstad et al.
patent: 6274820 (2001-08-01), DiStefano et al.
patent: 6524115 (2003-02-01), Gates et al.
patent: 2003/0003779 (2003-01-01), Rathburn

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