High density interconnect

Details High density interconnect High density interconnect

1990-02-28

1992-05-05

Bradley, Paula A.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

29876, 29842, 439 69, 439886, H01R 909

Patent

active

051102994

ABSTRACT:
A pair of elongated rectangular metallic bumps are formed on two separate surfaces. The bumps are aligned orthogonally prior to being merged by hybridization to form a high density hybrid assembly. Translational misalignment does not change the interconnect area. Rotational misalignment causes only a slight change in the interconnect area. The bump surface area is increased by merging the bumps. This reduces the hybridization pressure which prevents the interconnect area from increasing in size, commonly known as mash out. The invention makes high density hybrid assemblies practical because it reduces the risk of short circuits between adjacent interconnects and results in a high yield in production.

REFERENCES:
patent: 4239312 (1980-12-01), Myer et al.

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