Measuring and testing – Vibration – By mechanical waves
Patent
1995-04-03
1997-07-01
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
29 2535, 310325, 310334, 367140, H04R 1700, H01L 4108
Patent
active
056440855
ABSTRACT:
The present invention discloses a high density integrated ultrasonic phased array transducer and method for making. The high density integrated ultrasonic phased array includes a backfill material having an array of holes formed therein. Each of the holes are separated a predetermined distance apart from each other and have a predetermined hole depth. Each of the holes contain a conducting material deposited therein forming a high density interconnect with uniaxial conductivity. A piezoelectric ceramic material is bonded to the backfill material at a surface opposite the array of conducting holes. Matching layers are bonded to the piezoelectric ceramic material. The surface opposite the array of conducting holes is cut through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.
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Lorraine Peter William
Venkataramani Venkat Subramaniam
Finley Rose M.
General Electric Company
Goldman David C.
Snyder Marvin
Williams Hezron E.
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