High density integrated circuit package including interposer

Details High density integrated circuit package including interposer High density integrated circuit package including interposer

1995-09-22

1998-08-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 257675, 361813, 361773, H05K 720

Patent

active

057903786

ABSTRACT:
An integrated circuit package includes a first lead frame attached to the top surface of a substrate or interposer on which the die is mounted, and a second lead frame attached to the bottom surface of the interposer. The first lead frame is connected to bonding pads on the die by conventional means, and the second lead frame is attached to different bonding pads on the die by means of traces in the interposer and vias which extend through the interposer. The result is a package having a substantially greater lead density than packages which contain only a single lead frame.

REFERENCES:
patent: 4677526 (1987-06-01), Muhling
patent: 5184211 (1993-02-01), Fox
patent: 5378981 (1995-01-01), Higgins, III
patent: 5403784 (1995-04-01), Hashemi
patent: 5422514 (1995-06-01), Griswald
patent: 5483024 (1996-01-01), Russell
patent: 5489059 (1996-02-01), Rostoker

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