High density integrated circuit package

Details High density integrated circuit package High density integrated circuit package

1979-01-24

1980-06-17

Tolin, Gerald P.

Supports: cabinet structure

Arrangements of plural cabinets

Relatively movable

361391, 361415, H05K 716

Patent

active

042080797

ABSTRACT:
A high density integrated circuitry package is disclosed where gates containing the circuit cards are rotatably mounted in the cabinet with some of the gates fixed to a central core and other gates pivoted to the core. The pivoted gates are extendable outside of the cabinet for diagnostic and maintenance purposes and for simultaneously providing access to the fixed gates.

REFERENCES:
patent: 241123 (1881-05-01), Danner
patent: 2928555 (1960-03-01), Childs
patent: 2950155 (1960-08-01), Schick
patent: 3631325 (1971-12-01), Wenz
patent: 3745399 (1973-07-01), Usizima

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