High density in-package microelectronic amplifier

Details High density in-package microelectronic amplifier High density in-package microelectronic amplifier

2008-09-05

2009-12-01

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S728000, C361S763000, C174S260000

Reexamination Certificate

active

07626827

ABSTRACT:
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.

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