High density IC module assembly

Details High density IC module assembly High density IC module assembly

1984-05-30

1986-12-16

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 80, 361401, 174 52FP, H01L 2312, H01L 2318, H01L 2340

Patent

active

046300961

ABSTRACT:
An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, and the substrate have a smooth upper surface adapted to receive monolithic interconnections formed by planar metallization methods. The resulting assembly is enclosed in a housing also formed substantially from silicon, which contains electrically isolated pins for contacting the input-output electrodes of the assembly. Preferential etching is used to form the through-holes in the substrate as well as various alignment means on the substrate and other parts of the housing so that they are self-aligning during assembly. Improved performance, reliability, and low cost is obtained.

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