High density, high performance memory circuit package

Details High density, high performance memory circuit package High density, high performance memory circuit package

1993-11-08

1995-06-06

Dungba Vo, Peter

Metal working

Means to assemble or disassemble

Means to assemble electrical device

B23P 1904

Patent

active

054210798

ABSTRACT:
A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks. A pair of planar packages are mechanically connected in a back-to-back arrangement so that the apertures therebetween are aligned. The associated circuit cards are also back-to-back oriented so as to enable their joint interconnection into the female connector.

REFERENCES:
patent: 4007479 (1977-02-01), Kowalski
patent: 4520555 (1985-06-01), Gyi et al.
patent: 4547794 (1985-10-01), Tang
patent: 4979663 (1990-12-01), Sofia et al.
patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5085362 (1992-02-01), Art et al.
patent: 5175410 (1992-12-01), Freedman et al.

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