High density, high frequency, board edge probe

Details High density, high frequency, board edge probe High density, high frequency, board edge probe

2005-03-08

2005-03-08

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06864696

ABSTRACT:
A probe that connects test and measurement equipment to a device under test via a plurality of cables. The probe is formed of a plurality of printed circuit boards that are stacked together. Each board is connected to one of the plurality of cables and has a longitudinal set of pads along an edge electrically connected to the cable. The stacked plurality of printed circuit boards form a two dimensional array of pads for connecting to a similar set of pads on a device under test.

REFERENCES:
patent: 4340858 (1982-07-01), Malloy
patent: 4724377 (1988-02-01), Maelzer et al.

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