High density hermetic electrical feedthroughs

Details High density hermetic electrical feedthroughs High density hermetic electrical feedthroughs

1993-12-13

1995-07-18

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257693, 257699, H01L 2302

Patent

active

054343585

ABSTRACT:
A ceramic feedthrough for a package for an electronic device provides a plurality of electrical connections through an opening in the package. A method of making the feedthrough and of packaging the electronic device includes electrically conductive paths that are formed from a metal paste applied between green sheets that are joined and cofired to form a ceramic body. Vias extend from an exterior surface of the ceramic body to the paths to complete the electrical connection from outside the package to inside the package. A density of 50 paths per inch or greater may be achieved. The ceramic body may be hermetically sealed into an opening in the package and the body may have a peripheral extension to facilitate attachment of the feedthrough to the package.

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