High density heatsink attachment

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

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165 803, 361716, 361704, 257719, 257707, H01L 2326

Patent

active

058082360

ABSTRACT:
An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.

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IBM.TM. Technical Disclosure Bulletin, "Low Profile Heat Sink," vol. 28, No. 12, May, 1986.
IBM198 Technical Disclosure Bulletin, "Heat Sink Attachment for Improved Electro-Magnetic Compatibility and Shock Performance," vol. 38, No. 03, pp. 383-385, Mar., 1995.
"Spring-Loaded Heat Sinks for VLSI Packages," Research Disclosure, Oct. 1990, No. 318, Kenneth Mason Publications Ltd., England.
"Heatsink Attachment for Improved Electro-Magnetic Compatibility and Shock Perfomance," IBM Technical Disclosure Bulletin, vol. 38, No. 03, Mar. 1995, by J.S. Corbin et al., pp. 383-386.

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