High density grid array test socket

Details High density grid array test socket High density grid array test socket

1991-12-06

1993-04-27

Schwartz, Larry I.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, 439525, H01R 909

Patent

active

052057429

ABSTRACT:
A high density land grid array test socket comprises a leadless component contact socket assembly and a fixture. The contact socket assembly can be assembled with a variety of contact terminal end configurations and adapted for a desired mode of circuit board interface. In one embodiment, the test socket fixture includes a latching mechanism and a hinged lid assembly which allow quick and reliable manual installation of a device under test (DUT). An alternative embodiment includes snap latches, extension springs and alignment bushings which permit robotically controlled insertion and removal from the test socket. A bias clip or spring is incorporated in the test sockets for assuring proper alignment of the chip carrier with the contact socket assembly. The test socket creates reliable contacts with short electrical paths for low signal distortion and reduced chip loading.

REFERENCES:
patent: Re32370 (1987-03-01), Bright et al.
patent: 4222626 (1980-09-01), Hollyday et al.
patent: 4354720 (1982-10-01), Bakermans
patent: 4358175 (1982-11-01), Reid
patent: 4504105 (1985-03-01), Barkus et al.
patent: 4511196 (1985-04-01), Schuler et al.
patent: 4513353 (1985-04-01), Bakermans et al.
patent: 4636026 (1987-01-01), Cooney et al.
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4758176 (1988-07-01), Abe et al.
patent: 4761140 (1988-08-01), Geib
patent: 4838801 (1989-06-01), Bertoglio et al.
patent: 4906194 (1990-03-01), Grabbe
patent: 4918513 (1990-04-01), Kurose et al.
patent: 4928199 (1990-05-01), Diaz et al.
patent: 4929194 (1990-05-01), Korsunsky et al.
patent: 4961709 (1990-10-01), Noschese
patent: 5073116 (1991-12-01), Beck, Jr.

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