High density grid array test socket

Details High density grid array test socket High density grid array test socket

1993-01-05

1994-03-01

Schwartz, Larry I.

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

439 73, H01R 1362

Patent

active

052901939

ABSTRACT:
A high density land grid array test socket comprises a leadless component contact socket assembly and a fixture. The contact socket assembly can be assembled with a variety of contact terminal end configurations and adapted for a desired mode of circuit board interface. In one embodiment, the test socket fixture includes a latching mechanism and a hinged lid assembly which allow quick and reliable manual installation of a device under test (DUT). An alternative embodiment includes snap latches, extension springs and alignment bushings which permit robotically controlled insertion and removal from the test socket. A bias clip or spring is incorporated in the test sockets for assuring proper alignment of the chip carrier with the contact socket assembly. The test socket creates reliable contacts with short electrical paths for low signal distortion and reduced chip loading.

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