High density frontplane interconnection system

Details High density frontplane interconnection system High density frontplane interconnection system

1989-12-26

1992-12-22

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361399, 361413, H05K 714

Patent

active

051738457

ABSTRACT:
A novel frontplane structure for use with a plurality of parallelly mounted printed circuit boards having respective sets of a plurality of electrical connectors mounted to the front edge of the printed circuit boards is disclosed in which a multi-layer printed circuit board is mounted to a sheet metal sub-chassis that includes integral injector/ejector devices which, by means of a cam action, produce a reduction in the mechanical effort required to mate the frontplane with each of the connectors contained on the plurality of printed circuit board assemblies installed into a card cage assembly or computer chassis to which the frontplane is to be connected is disclosed. A plurality of high density printed circuit connectors are mounted to the multi-layer printed circuit board for interconnecting with the sets of connectors mounted to the front edges of the printed circuit board assemblies.

REFERENCES:
patent: 3675083 (1972-07-01), White
patent: 3992654 (1976-11-01), Springer et al.
patent: 4002381 (1977-01-01), Wagner et al.
patent: 4134631 (1979-01-01), Conrad et al.
patent: 4151580 (1979-04-01), Struger et al.
patent: 4250536 (1981-02-01), Barringer et al.
patent: 4470100 (1984-09-01), Rebaudo et al.
patent: 4573753 (1986-03-01), Vogl
patent: 4602829 (1986-07-01), De Andrea
patent: 4893405 (1990-01-01), Pennington

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