High density front access device

Electricity: conductors and insulators – Boxes and housings

Reexamination Certificate

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Details

C174S068100, C174S068300, C385S135000, C361S797000

Reexamination Certificate

active

11061650

ABSTRACT:
A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.

REFERENCES:
patent: 5801921 (1998-09-01), Miller
patent: 6185092 (2001-02-01), Landrum et al.
patent: 6301095 (2001-10-01), Laughlin et al.
patent: 6307750 (2001-10-01), Bendikas et al.
patent: 6473608 (2002-10-01), Lehr et al.
patent: 6643566 (2003-11-01), Lehr et al.
patent: 6708830 (2004-03-01), Mendoza
patent: 2002/0170726 (2002-11-01), Mendoza
patent: 2004/0035983 (2004-02-01), Simonson et al.
patent: WO 02/103359 (2003-12-01), None
PCT/IL20005/000206- ISR, Jul. 6, 2005, PowerDsine, Ltd.

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