High density flexible socket interconnect system

Details High density flexible socket interconnect system High density flexible socket interconnect system

2007-09-20

2008-11-11

Nguyen, Khiem (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07448877

ABSTRACT:
An interconnect member for socket connector includes a carrier having opposite first and second sides. A plurality of polymer columns are held in the carrier. Each polymer column includes a first end extending from the first side of the carrier and a second end extending from the second side of the carrier. A contact array includes a plurality of electrical contacts held in the carrier. Each of the plurality of contacts includes a body that extends through the carrier and opposite end portions positioned to engage respective first and second ends of the polymer columns. Each end portion includes a contact tip configured to electrically engage a contact pad on one of a circuit board and an electronic package. The polymer columns simultaneously provide a predetermined normal force to establish reliable electrical connectivity between the circuit board and the electronic package and a predetermined working range for the interconnect member.

REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 6358064 (2002-03-01), Szalay et al.
patent: 6830460 (2004-12-01), Rathburn
patent: 6939143 (2005-09-01), Rathburn
patent: 6957963 (2005-10-01), Rathburn
patent: 7070420 (2006-07-01), Wakefield et al.
patent: 7121839 (2006-10-01), Rathburn
patent: 7220135 (2007-05-01), Brekosky et al.

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