High density encapsulated wire circuit board

Details High density encapsulated wire circuit board High density encapsulated wire circuit board

1984-10-10

1985-11-19

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361406, 361414, H05K 103

Patent

active

045544050

ABSTRACT:
A high density dimensionally stable encapsulated circuit board and a method of making such a board is described. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.
At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.

REFERENCES:
patent: 3674914 (1972-07-01), Burr
patent: 3955024 (1976-05-01), Goldman et al.
patent: 4030190 (1977-06-01), Varker
patent: 4140831 (1979-02-01), Miller
patent: 4287014 (1981-09-01), Gaku et al.
patent: 4388136 (1983-06-01), Huie
patent: 4395459 (1983-07-01), Herschdorfer et al.

Affiliated with

Also associated with

Rating

High density encapsulated wire circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density encapsulated wire circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density encapsulated wire circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-84937