High density element structure formed by assembly of layers...

Incremental printing of symbolic information – Thermal marking apparatus or processes – Specific resistance recording element type

Reexamination Certificate

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Reexamination Certificate

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06909445

ABSTRACT:
A structure including a sequence of elements for sending or receiving a signal along an axis. Two successive elements along the direction of the axis are offset with respect to each other along the direction perpendicular to the axis. The structure includes at least two layers of material deposited on a reception substrate using the layer transfer technique. The structure particularly relates to any type of structure for which elements must have a high density, such as a print bead, networks of optical components, antenna networks, etc.

REFERENCES:
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patent: 5402436 (1995-03-01), Paoli
patent: 5485193 (1996-01-01), Inoue et al.
patent: 5624708 (1997-04-01), Sedberry
patent: 0 335 473 (1989-10-01), None
patent: 0 493 055 (1992-07-01), None
patent: 60 054866 (1985-03-01), None
patent: 63 290767 (1988-11-01), None
W.P. Maszara et al.: “Bonding of silicon wafers for silicon-on-insulator” J. Appl. Phys., vol. 64, No. 10, pp. 4943-4950 Nov. 15, 1988.

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