High-density electronic processing package-structure and fabrica

Details High-density electronic processing package-structure and fabrica High-density electronic processing package-structure and fabrica

1983-07-25

1985-07-02

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29576J, 29591, 357 75, 250553, H01L 2190, H01L 2192

Patent

active

045259216

ABSTRACT:
A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

REFERENCES:
patent: 3748479 (1973-07-01), Lehovec

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