High-density electronic processing package--structure and fabric

Details High-density electronic processing package--structure and fabric High-density electronic processing package--structure and fabric

1985-04-08

1987-02-24

Davie, James W.

Radiant energy

Ionic separation or analysis

Static field-type ion path-bending selecting means

250370, 250578, H01L 2348

Patent

active

046461280

ABSTRACT:
A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

REFERENCES:
patent: 3748479 (1973-07-01), Lehovec
patent: 4283755 (1981-08-01), Tracy
patent: 4500905 (1985-02-01), Shibata
patent: 4551629 (1985-11-01), Carson et al.

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