High density electronic package comprising stacked sub-modules

Details High density electronic package comprising stacked sub-modules High density electronic package comprising stacked sub-modules

1987-01-05

1988-08-16

Paschall, M. H.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29830, 361386, H05K 700

Patent

active

047648465

ABSTRACT:
A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity, inside which one or more IC chips are located. Each cavity-providing sub-module may be formed either by securing a rectangular frame to a chip-carrying substrate, or by etching a cavity in a single piece of material. In the latter case, the chips are mounted on the flat surface of one sub-module, and located inside the cavity of the next sub-module.

REFERENCES:
patent: 2803788 (1957-08-01), Sanders, Jr.
patent: 3147402 (1964-09-01), Hochstetler
patent: 3227926 (1966-01-01), Parstorfer et al.
patent: 3268772 (1966-08-01), Kamei et al.
patent: 3403300 (1968-09-01), Horowitz et al.
patent: 3898535 (1975-08-01), Ebbert
Jackson et al., "Heat Transfer Structure for Electronic Subassemblies", IBM Technical Disclosure Bulletin, vol. 13, No. 12, May 1971, pp. 3644-3645.

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